Particleboard with bio-based adhesive: Lignin-HMF resin from residues and alternative wood species from climate-resilient mixed forests.

Fraunhofer WKI and its partners are advancing a new class of sustainable, formaldehyde-free binders that reposition particleboard manufacturing for a low-emission future.

As part of the ‘LowEPanel’ project, researchers are developing lignin-HMF condensation resins designed to work with regional wood residues and recycled fibre streams.

Team members describe the effort as a shift from merely reducing emissions to fundamentally rethinking how adhesives can be sourced, synthesised, and integrated into industrial production.

At the core of the technology is lignin, a readily available by-product generated in pulp and bioethanol plants. When paired with hydroxy-methyl-furfural (HMF) – a platform chemical obtained through sugar dehydration – the combination yields a fully bio-based adhesive that avoids formaldehyde while reducing reliance on fossil feedstocks.

Researchers explain that the formulation offers not only environmental advantages but also the potential for improved recyclability of wood-based panels, a growing priority in both construction and furniture sectors.

The project extends beyond adhesive chemistry. The consortium is examining whether alternative wood species from climate-resilient mixed forests can be used effectively in particleboard production, opening new sourcing routes as forest landscapes evolve.

Building on the earlier ‘AdLigno’ project, where lignin-HMF resins were proven at laboratory scale, ‘LowEPanel’ now addresses scaling, dosing technology, and integration into continuous industrial processes.

With raw material suppliers, process developers, resin specialists, and panel manufacturers involved, the initiative represents a full-chain approach aimed at accelerating commercial adoption and strengthening circularity within wood-based materials. More information: www.wki.fraunhofer.de.

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